Solder Wires – Kristall 605 and 611

The Kristall 605 and Kristall 611 solder wires are halogen-activated flux solder wires that open the process window in many places. Greatly reduced flux spitting combined with good wetting behaviour on poorly solderable surfaces are the highlights of these innovative products.
 

Product Advantages

• Fairtin solder
• bright No-Clean residues
• low spitting
• very good wetting properties for fast soldering
• chemically modified resin that reduces the health risks associated with the use of rosin-based fluxes
• mild odour
   

Application Areas

Designed for manual rework as well as for automated soldering equipment, Kristall 605 and Kristall 611 allow to cover the different production needs in modern electronics manufacturing. The flux contained meets the requirements of J-STD-004C standards. Kristall 605 is classified as REL1, and Kristall 611 is classified as REM1. Both solder wires are offered in the alloys Flowtin and SN100C^TM. These alloys are gentle on the soldering tips, which considerably increases their service life.

Solder Paste – SP6000

The SP6000 solder paste was developed for use with lead-free alloys. The use of recycled solder can reduce raw material-related CO₂ emissions compared with equivalent solder pastes made from primary tin. The flux, which is classified as REL0, also convinces with an uncompromising wetting quality on all known lead-free PCBs in both air and nitrogen atmospheres. SP6000 leaves behind exceptionally little residues, which are also transparent and non-corrosive.
 

Product Advantages

• solder powder made from recycled solder
• very suitable for use with low silver content (TSC105)
• high contour stability, ideal for fine pitch up to 0.4 mm
• very good first print results after longer printer downtime
• reflow soldering process under air or nitrogen possible
• low mid-chip balling on passive components due to anti-capillary effect
• very good wetting on most surfaces
• RoHS compliant
   

Application Areas

The solder paste SP6000 was developed for stencil printing. With lead-free alloys as solder powder in particle size 4 (particle size 5 on request), solder paste SP6000 can be used in all common open and closed printing systems. It is also available as a dispensable solder paste (SP6000D).

 

More information about our SP6000-series:

SP6000      SP6000 TBS04         SP6500

 

Solar Fluxes – EF160 Bio PV and EF180 Bio PV

The fluxes EF160 Bio PV and EF180 Bio PV were specially developed for use in the photovoltaic module industry and, as No-Clean fluxes, meet all its requirements. Both fluxes are halogen- and resin-free and low in solids. EF180 Bio PV has a slightly higher solids content in comparison and has a lightly stronger activation than EF160 Bio PV. The innovative fluxes ensure very good solderability in module assembly processes for soldering by IR and convection.The use of bio-based raw materials reduces the proportion of fossil-based raw materials while maintaining the same technical quality requirements.
 

Product Advantages

• No-Clean
• low residue – minimal equipment contamination, low maintenance
• low solids content
• excellent peel force resistivity
• very good wettability
   

Application Areas

EF160 Bio PV and EF180 Bio PV offer a wide thermal process window, making them suitable for lead-free and leaded soldering processes. They exhibit high peel forces that keep solder joints stable over the long term. The fluxes can be applied by spray or dip processes. They are suitable for both automated spray and stringer applications and can also be used for hand soldering.

Water-Based Fluxes – WF130 and WF131

WF130 and WF131 are developments of water-based ORL0 fluxes. Both deliver perfect soldering results and leave very low amounts of electrically harmless residues in combination with an extremely low corrosion potential. Both water-based fluxes are halogen-free and have a VOC content of less than one percent. Due to the very low corrosive potential, both can be classified as L0, which is not often possible with water-based fluxes. The main difference of the WF131 is a further reduction of the residue level, with the small trade-off of a slightly smaller process window.
 

Product Advantages

• No-Clean
• suitable for lead-free soldering with all common alloys
• application by spray fluxer
• non-flammable formulation (VOC content < 1 percent)
• good wettability and good through-hole filling
• water-based
   

Application Areas

WF130 and WF131 show good wetting on oxidised copper as well as on all common protective surfaces (HAL, Ni/Au, chem. Sn and chem. Ag). They also ensure excellent filling of through-holes.

Flux for selective soldering – SF1000 Bio

The flux SF1000 Bio was specially developed for selective soldering of electronic assemblies. The low solids content in combination with specially adjusted halogen-free activation results in excellent wettability of a wide variety of surfaces (e.g. OSP, Ni/Au, HAL), even with lead-free solder alloys. According to DIN-EN 16785-2, a 95 percent bio-based content is determined.
 

Product Advantages

• No-Clean
• low residue
• resin-free
• optimised solids content
• fast wetting
• wide process window
• good penetration
• J-STD-004C, class ORL0
   

Application Areas

Stannol SF1000 Bio can be used in spray fluxers. It shows good wetting at soldering temperatures in the range of 260 °C to 320 °C. It can also be used in other soldering processes such as wave and dip soldering.