Stannol Solder Paste SP6500
Excellence at High Volumes – Maximum Stability for Mass Production
In industrial electronics production, stable processes determine quality and efficiency. The Stannol solder paste SP6500 was developed specifically for precisely this environment: for maximum quantities, long production runs and reproducible results without compromise.
As part of the greenconnect product range, SP6500 combines high technical performance with the use of recycled solder, helping to reduce raw material-related CO2 emissions compared with equivalent solder pastes made from primary tin. In doing so, it sets new standards in high-volume SMT production.
Stability that makes series production possible
SP6500 stands for exceptional process stability at high volumes. The specially developed formulation ensures consistently high print-to-print consistency, long stencil life and reliable reflow results – even under demanding production conditions. This makes SP6500 the solder paste for manufacturers who want to minimise downtime, reduce rework and safeguard their processes in the long term.
Your advantages at a glance:
1. Consistent performance in stencil printing
- Excellent print stability even with long print cycles
- Reproducible results over at least 6 hours without re-dosing
- 24-hour SMT production capability at 20-32 °C
2. Ideal for high-volume production
- Developed for series and mass production
- High process window stability with demanding soak-reflow profiles
- Suitable for air and nitrogen atmospheres
3. Reliable wetting and soldering quality
- Very good wetting behaviour on all common surfaces
- High placement reliability and good self-alignment
- Low tombstoning and solder-balling rates
4. Reliable results – No-Clean technology
- Minimal, transparent residue after reflow
- High electrical reliability
- Cleaning usually not required
Designed for process reliability and resource-conscious material use
SP6500 combines its processing characteristics with the following product features:
- solder powder made from recycled solder
- reduced raw material-related CO2 emissions compared with equivalent solder pastes made from primary tin
- halogen-free formulation (“Halogen Zero”)
SP6500 thus supports more resource-conscious electronics production – without compromising on quality or performance.
Developed for modern SMT requirements
- Fine-pitch applications up to 0.4 mm
- Outstanding tackiness for high-speed pick and place systems
- Excellent print-to-print consistency
Compatible with almost all common stencil printing systems
SP6500 offers a wide, robust process window and supports stable production processes even with complex PCB layouts.
Typical areas of application
- High-volume SMT production
- Automated series and mass production
- Applications with long printing and service lives
Production with the highest demands on process reliability and sustainability
Stannol solder paste SP6500 is the ideal choice for manufacturers who rely on maximum stability, reproducible quality and resource-conscious processes for high volumes.
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