Solder Paste SP6000
The solder paste SP6000 is part of Stannol's more sustainable greenconnect product line. The use of recycled solder can reduce the raw material-related CO2 emissions of this solder paste compared with equivalent solder pastes made from primary tin. The solder paste was developed for use with lead-free alloys.
With SP6000, a very good first print is possible even after a long period of printer downtime. The flux, which is classified as REL0, also convinces with an uncompromising wetting quality on all known lead-free PCBs and component coatings in both air and nitrogen atmospheres.
Features
- solder powder made from recycled solder
- suitable for use with low silver content (TSC105)
- high contour stability, suitable for fine pitch up to 0.4 mm
- very good first print results after longer printer downtime
- reflow soldering process under air or nitrogen possible
- low mid-chip balling on passive components due to anti-capillary effect
- very good wetting on most surfaces
- RoHS-compliant
Application
Solder paste SP6000 was developed for stencil printing. With lead-free alloys as solder powder in particle size 3 (25 to 45 µm) and 4 (20 to 38 ?m), solder paste SP6000 can be used in all common open and closed printing systems.
Cleaner
Pre soldering: cleaner Flux-Ex Pre
After soldering: cleaner Flux-Ex Post