Solder paste SP6000 – our new standard
We are pleased to introduce our new SP6000 solder paste. It combines reliable processing characteristics with the use of recycled solder, helping to reduce raw material-related CO2 emissions compared with equivalent solder pastes made from primary tin. SP6000 was specifically developed for use with lead-free alloys.
Technical performance and defined environmental considerations
During the development of SP6000, selected environmental considerations were taken into account alongside its technical properties. The use of recycled solder can reduce raw material-related CO_2 emissions compared with equivalent solder pastes made from primary tin. Additional measures include packaging materials containing recycled content and initiatives addressing transport-related emissions.
SP6000 therefore combines reliable processing characteristics with a more considered approach to raw materials and packaging.
What responsible business practices mean to us
Discover the measures we take to address social and environmental considerations in the development of our soldering products and our sourcing of raw materials.
More about our activities
SP6000 – part of our greenconnect series
Under the greenconnect name, Stannol offers a comprehensive product range subject to defined criteria for raw material sourcing, material selection and product design.
More about our greenconnect products
Classification
SP6000 solder paste meets all criteria of the J-STD-005 and RoHS directives. Its wetting properties are ideally suited for lead-free PCBs and component coatings. The flux residues after the reflow process are transparent and non-corrosive.
Dispensable version
SP6000 is also available as a dispensable solder paste (SP6000D).
The advantages of SP6000 at a glance:
- Reduced raw material-related CO2 emissions through the use of recycled solder compared with equivalent solder pastes made from primary tin.
- Very well suited for low silver applications (TSC105): versatile and powerful
- Suitable for fine pitch applications: precise and reliable
- Very good first prints after longer printer downtime: time and resource-saving
- Reflow process possible under air or nitrogen: flexible and adaptable
- Very good wetting: consistent results
- J-STD-005 compliant: classified according to well-known standard
- RoHS-compliant: meets the applicable substance restrictions of the RoHS Directive
Discover our new solder paste SP6000
Do you have any questions about our products?
Our application engineers will be happy to help you. Contact us, we are here for you!
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