SP6000 TBS04

for soldering processes at low temperatures

Lotpaste in Anwendung

    SP6000 TBS04

    The solder paste with recycled solder for sensitive electronics

    The demands placed on modern electronic assemblies are increasing – and with them the need for gentle, energy-efficient soldering processes, because
     

    • less thermal stress protects sensitive PCBs and extends the service life of your assemblies.
    • lower process temperatures mean lower energy consumption, lower costs and reduced system wear.
    The image shows a stylized thermometer graphic that arranges different solder alloys according to their melting temperatures. The thermometer is shown vertically, with a scale from 120 °C to 240 °C on the right-hand side. At the very top at the highest temperatures, around 240 °C, are the lead-free solders SnCu0.7 and SnAg3.0Cu0.7, which require high processing temperatures. Below this, at around 183 °C, is the lead-containing standard alloy SnPb37. Further down, at around 138 °C, a special alloy with the composition Bi57.6Sn42Ag0.4 is shown. This alloy is highlighted in blue to emphasize the low processing temperature. At the bottom, at around 120 °C, the alloy SnIn52 is noted. It has the lowest melting temperature compared to the other alloys shown. The color scheme of the thermometer ranges from deep blue at the bottom (for low temperatures) to a bright red at the top (for high temperatures). This visually emphasizes the temperature differences between the alloys.

    The solution: SP6000 TBS04 from Stannol

    The image shows a stylized thermometer graphic that arranges different solder alloys according to their melting temperatures. The thermometer is shown vertically, with a scale from 120 °C to 240 °C on the right-hand side. At the very top at the highest temperatures, around 240 °C, are the lead-free solders SnCu0.7 and SnAg3.0Cu0.7, which require high processing temperatures. Below this, at around 183 °C, is the lead-containing standard alloy SnPb37. Further down, at around 138 °C, a special alloy with the composition Bi57.6Sn42Ag0.4 is shown. This alloy is highlighted in blue to emphasize the low processing temperature. At the bottom, at around 120 °C, the alloy SnIn52 is noted. It has the lowest melting temperature compared to the other alloys shown. The color scheme of the thermometer ranges from deep blue at the bottom (for low temperatures) to a bright red at the top (for high temperatures). This visually emphasizes the temperature differences between the alloys.

    With SP6000 TBS04, Stannol presents an innovative No-Clean LMPA solder paste that has been specially developed for applications with reduced peak temperatures in the reflow process, such as in the field of LED technology or optoelectronics.

    Based on the Bi57.6Sn42Ag0.4 alloy, the BSA solder paste combines reliable processing characteristics with the use of recycled solder.

    Graphic: Stannol Bi57.6Sn42Ag0.4 compared to other common alloys.

    Your advantages at a glance

    • Low melting range (~140 °C): ideal for temperature-sensitive components – with a maximum reflow temperature of only 170-180 °C
    • Solder powder made from recycled material: helping to reduce raw material-related CO2 emissions compared with equivalent solder powder made from primary raw materials
    • Lower system wear & energy consumption: reduced process temperature measurably reduces your operating costs
    • High long-term reliability: significantly more durable than pure BiSn alloys thanks to silver content (0.4 %)
    • Fine precision: suitable for fine-pitch applications down to 0.4 mm – perfect results even with miniature components
    • Process stability: very good contact pressure behavior even after longer printing breaks
    • Flexible use in the reflow process: under air or nitrogen
    • Excellent wetting properties: can be used on a wide range of common surfaces
    • Naturally RoHS-compliant
    The image shows a green solder paste tin from Stannol. It has a white label with the Stannol logo and further product specifications.

    Who is SP6000 TBS04 suitable for?

    The image shows a green solder paste tin from Stannol. It has a white label with the Stannol logo and further product specifications.

    The BSA solder paste SP6000 TBS04 is the ideal solution for developers and manufacturers who:

    • need to process sensitive electronic components safely and gently.
    • work in optoelectronic and LED applications with limited thermal load capacity.
    • want to reduce their production costs but do not want to compromise on quality and reliability.
    • aim to reduce raw material-related CO2 emissions in electronics manufacturing through the use of recycled solder.

    High technical performance. Resource-conscious design.

    Made by Stannol.

    With SP6000 TBS04, you are choosing a high-performance solder paste that combines reliable processing characteristics with the use of recycled solder. This helps meet technical and economic requirements while reducing raw material-related CO2 emissions compared with equivalent solder pastes made from primary raw materials.

    More possibilities – thanks to precise dosing.

    SP6000D TBS04.

    SP6000 TBS04 is also available on request as a dosable version (SP6000D TBS04).

     

    Find out more now and contact our expert

    The picture shows a man in a dark jumper. He has grey hair and is smiling friendly into the camera.

    Dirk Rüdell

    Team leader External Sales

    +49 176 1166 8826

     

    Technical Data

    PDF Technical Data Sheet SP6000 TBS04