SP6500
Halogen-zero solder paste SP6500 is part of Stannol's sustainable greenconnect product line. The special feature: With SP6500, about 85 percent of CO2 emissions can be saved compared to conventional solder pastes, mainly through the use of recycled solder.
SP6500 was specifically developed for fine-feature printing and reflow processes using the most demanding soak reflow profiles, both in air and nitrogen atmospheres. Thanks to its specially engineered formulation, SP6500 provides excellent wetting behaviour and fully meets the requirements of a modern solder paste for high-volume electronics manufacturing. Its wetting performance has been optimized for all commonly used surfaces in the electronics industry.
SP6500 only leaves minimal residues on the PCB after the reflow process. These residues exhibit outstanding electrical reliability, eliminating the need for post-reflow cleaning.
Features
solder powder made from recycled solder
about 85 percent CO2 savings
halogen-zero
especially formulated for lead-free alloys
suitable for fine pitch down to 0,4 mm
compatible with a wide range of solderable surfaces
long stencil life, consistent performance for at least 6 hours of continuous printing without addition of new paste, 24 hour SMT production ability achieved from 20 °C up to 32 °C
leaves only very small amounts of transparent residues after soldering
high tackiness for high speed pick-and-place equipment
ensures high pick-and-place yields, good self-alignment and a low tomb-stoning defect rate
exceptional print-to-print consistency
Application
Cleaner
After soldering: Flux-Ex Post Power
Alloy
- Sn99,3Cu0,7
- Sn96,5Ag3,0Cu0,5
Downloads
Technical datasheet Safety data sheetContact person
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Distribution Network