Stannol will be presenting its solutions at the new trade fair in Stuttgart from 6 to 8 October 2026. At stand 9C64, the company will be showcasing its SP6000 and SP6500 solder pastes, among other products, and explaining how process reliability, reproducibility and sustainability can be combined in SMT manufacturing.
SP6000 and SP6500 solder pastes take centre stage
The SP6000 solder paste has been developed for use with all lead-free alloys. It offers optimised wetting properties on all commonly used lead-free PCB and component finishes. Designed for low-volume/high-mix production, the product combines versatility with cost efficiency.
The SP6500 solder paste has been developed for manufacturers who require maximum process stability and consistently high quality in high-volume/low-mix SMT production. Its specially developed formulation ensures consistently high print-to-print consistency, long stencil life and reliable reflow results.
Cost-efficient and sustainable
SP6000 and SP6500 are part of Stannol’s sustainable greenconnect range. By using recycled solder, they have a reduced CO_2 footprint compared with conventional solder pastes. Both solder pastes are ideally suited for use with low-silver-content alloys such as TSC105 and TSC0307, as well as silver-free alloys such as SN100CV.
Discussing sustainability and process stability
“EFX gives us the opportunity to present our solutions for different requirements in electronics manufacturing through direct, expert dialogue. With SP6000 and SP6500, we are showcasing two solder pastes that combine sustainability and reliable processes in different ways,” explains Thomas Kolossa, Head of Sales at Stannol.
Thomas Kolossa, application engineer Eileen Arndt, and application engineers Dirk Rüdell and Werner Mittermann will be available at the Stannol stand for discussions.