Thermal Profiler 4D

temperature and process monitoring

    Stannol Smart 4D Thermal Profiler

    No more invisible errors: Ensure that every soldering profile is perfect

    The Smart 4D Thermal Profiler was developed to eliminate uncertainties during soldering. In modern soldering processes, precise temperature control is crucial to reliably achieve good solder joints and avoid failures. The profiler measures and analyses the temperature curves directly on the assembly so that problems can be detected early and processes can be optimally adjusted.

    Your advantages

    • Real 4D Profiling: captures temperature (at the sensors), system temperature (via pyrometer), vibration measurements in XYZ (via accelerometers), and time
    • Fast and precise temperature measurement: directly on the assembly for maximum process control
    • Prevention of soldering defects: through precise analysis and software-supported optimization of the soldering profile
    • Easy operation and intuitive software: with real-time data and clear evaluations
    • Improved system control: temperature and vibration measurements enable early detection of technical issues
    • Component-specific optimization: fine-tuning of the soldering profile considering different component requirements
    • Universally applicable: suitable for various oven types and soldering applications

     

    Optimise your soldering process now - with precise 4D temperature monitoring

    Support in four dimensions

    The Stannol Smart 4D Thermal Profiler offers you an innovative 4D solution that analyses other important parameters in addition to the classic recording of a temperature profile.

    Optimisation of the oven settings: Using the CPIs used to define the process windows, the software provides the ability to optimise the oven settings to maximise the quality of your soldering processes.
    Optimisation of the oven settings: Using the CPIs used to define the process windows, the software provides the ability to optimise the oven settings to maximise the quality of your soldering processes.

    The four dimensions:

    1. Temperature at the temperature sensors: Get precise readings directly at the crucial points of your assembly.
    2. Vibration measurement: Measure the vibrations in your system using advanced acceleration sensors (in the X, Y and Z directions) to detect changes in system behaviour at an early stage before they affect the process.
    3. Equipment temperature: Use pyrometer technology to monitor the temperature of the soldering equipment itself and ensure that it remains within optimal operating parameters.
    4. Time: View and analyse the evolution over time of the aforementioned dimensions.

    Highly functional software

    The Stannol Smart 4D Thermal Profiler software offers a wide range of functions that further improve your monitoring and analysis:

    Individual process windows: A special function of the software is the option of assigning a separate process window to each temperature sensor. This allows several process windows to be checked simultaneously in one measurement.
    • Selection of soldering systems:
      Many common soldering systems can be selected in the software to enable flexible customisation to your specific requirements.
    • Live data readout:
      The measurement results can be viewed during the measurement process thanks to the Wi-Fi functions.
    • Solder paste management:
      Define and select different solder pastes to ensure the right materials are used for your applications.
    • Process windows:
      Define process windows to control the temperature profile. Critical Process Indicators (CPIs) are defined within these windows, which define a target range and an exact target value (e.g. time above melting temperature: 30-60 seconds, target value 45 seconds).
    Individual process windows: A special function of the software is the option of assigning a separate process window to each temperature sensor. This allows several process windows to be checked simultaneously in one measurement.

    Properties

    • 6 measuring channels for temperature sensors (type K)
    • 2 pyrometers for system monitoring
    • Acceleration sensors (XYZ) for vibration measurement
    • Software with analysis and optimisation function
    • Rechargeable via USB-C connection

    Specification/technical data

    Internal operating temperatures -0 °C to 75 °C
    Accuracy +/- 0.5 °C
    Resolution 0.1 °C
    Measurement rate 0.1 to 50 readings per second
    Temperature range -250 °C to 1200 °C
    Wi-Fi 2.4 GHz
    Measuring inputs 6 channels, K type, standard
    Acceleration sensors 1 x X-axis, 1 x Y-axis, 1 x Z-axis
    Pyrometer 2
    LEDs for battery status 4
    Device status LEDs 4
    Dimensions L x W x H mm  
    Device dimensions 120 x 65.5 x 14.5 mm
    Protective box steel dimensions 281 x 78 x 24 mm
    Protective box with insulation dimensions 281 x 80.5 x 27.5 mm
    Internal power supply 2 x AAA Ni-MH batteries rechargeable via USB-C

    We are happy to support you

    If you have any questions or would like an individual solution, our GEN3 Systems expert Nicolas Wiacker will be happy to support you.

     

    The picture shows a blond young man in a blue shirt and suit jacket. He is wearing glasses and is smiling friendly into the camera.

    Nicolas Wiacker

    Technical Sales, Measuring & Testing Systems, HumiSeal

    +49 170 658 7212

     

    Technical data sheet

    PDF Technical Data Sheet

    CPU: 1 Ghz or faster with 2 or more cores.
    Memory: 4GB RAM
    Hard drive: 64 GB or more
    Ports: 1 or more USB type A ports
    Operating system: Operating system: Microsoft® Windows® 10 newer

    • Stannol 4D Smart Profiler
    • USB Wi-Fi dongle
    • Temperature protection box
    • Transport case
    • Carrier for the device (carrier)
    • USB-C to USB-C cable or USB-A to USB-C cable
    • Protective gloves
    • 6 type K thermocouples
    • Scissors
    • 6x aluminium adhesive strips
    • Digital user manual
    • 2 year warranty (excluding batteries)