Solder Alloy SN100CV®

SN100CV^® is a silver-free, micro-alloyed solder developed and patented by the Japanese company Nihon Superior (German (DE) patent number 60211068917.7).

Bismuth in the alloy contributes to sustained mechanical strength and long-term reliability. The micro-alloyed addition of nickel reduces copper enrichment in the solder bath and guarantees a more stable process. The nickel content also leads to a more refined intermetallic layer, which increases the long-term stability of the solder joints. A second micro-alloyed element, germanium, minimises dross formation and thus contributes to resource efficiency and environmental protection. 

The alloy exhibits very good wetting behaviour and a significantly lower tendency toward bridge formation. This helps to reduce defect rates and improves overall quality.