Roartis

Underfills und Corner/Edgebond Materials

[Translate to Englisch:] Nahaufnahme einer Computerplatine mit Prozessor und elektronischen Bauteilen.

    Underfills and Corner/Edgebond Materials

    IQ-BOND underfills and corner-bond/edge-bond materials are epoxy-based materials used in electronic assemblies to fill the gap between BGA, CSP, or flip-chip components and the printed circuit board.

    Underfilling reliably protects sensitive components from mechanical stress, shock, thermal cycling and vibration, thereby enhancing the long-term reliability of the assembly.

    Underfills

    The capillary underfill materials offer optimised properties, including:

    • high glass transition temperature (Tg)
    • low coefficient of thermal expansion (CTE)
    • excellent flow characteristics


    This makes the materials suitable for applications with very small gap sizes and high component density in electronics manufacturing.

     

    Product Curing Viscosity (mPa*s) CTE (ppm) Tg (°C) Working Life Storage Notes
    IQ-Bond 2473-LV 3 min @ 150°C
    60 min @ 100°C    		 375 60 105 5 days 4 months @ 5°C
    12 months @ −20°C
    • fast curing
    • long working life
    • no dry-ice shipment required
    IQ-Bond 2481 3 h @ 150°C
    2 h @ 90°C + 3 h @ 150°C    		 30000 18 230 12 h 3 months @ −20°C
    6 months @ −40°C
    • low CTE
    • high Tg
    • approved for space applications
    IQ-Bond 2476 15 min @ 160°C
    120 min @ 120°C    		 12500 26 125 24 h 6 months @ −40°C
    • approved for space applications
    IQ-Bond 2477 15 min @ 160°C
    120 min @ 120°C    		 5000 30 130 48 h 6 months @ −40°C
    • fine-gap application

    Cornerbond- und Edgebond-Materialien

    The wide range of Cornerbond and Edgebond materials has been specifically developed to meet the requirements of modern electronics and industrial applications.

    These high-performance adhesive solutions provide high bond strength and long-term stability, ensuring secure connections even under demanding conditions.

    IQ-BOND Cornerbond and Edgebond materials are used in, among other areas:

    • Automotive applications
    • Aerospace
    • Electronics manufacturing
    • Industrial applications

     

    By enabling precise and reliable bonding, they help improve the mechanical stability, product quality, and long-term reliability of electronic assemblies.

     

    Product Curing Viscosity (mPa*s) CTE (ppm) Tg (°C) Working Life Notes
    IQ-Bond 2493-T 3 min @ 150°C
    60 min @ 100°C    		 2000 35 105 48 h
    • high thermal conductivity
    IQ-Bond 2496-CB Co-curing in a typical reflow process 85000 22 230 24 h
    • cornerbond
    • withstands continuous operating temperatures above 250°C
    • can be cured during the standard reflow process

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