Functional Inks for Printed Electronics
The broad range of functional inks for printed electronics is suitable for screen-printing and inkjet-printing processes.
The materials are used in a variety of industries, including:
- IoT applications
- Consumer electronics
- Medical technology
- Automotive
- Construction
The inks are designed for fine structures and complex functionalities while providing reliable electrical conductivity and functional performance.
Thermally Conductive Adhesives
Thermally conductive adhesives support efficient heat dissipation in electronic assemblies, particularly as power density increases and components become more compact.
The materials include one- and two-component systems featuring:
- Thermal conductivity of >5 W/m·K
- Dielectric properties
- Suitability for thin bond lines
They are ideally suited for applications in which heat must be reliably dissipated from temperature-sensitive components.
Flame-Retardant Adhesives
Flame-retardant adhesives and resins protect electronic components in the event of fire and meet stringent safety requirements.
The materials are:
- Halogen-free
- UL 94 V-0 rated
They are used particularly in automotive, industrial, and energy applications where fire protection and reliability are essential.
Thermal Gap Fillers
Liquid gap fillers provide effective thermal coupling between components and are designed for demanding applications.
Advantages over conventional thermal pads include:
- Improved heat dissipation
- High resistance to vibration
- Silicone-free formulations, preventing contamination of sensitive components
- High bond strength
Typical applications include automotive and industrial environments subject to harsh conditions.
Structural Adhesives
Roartis offers epoxy- and hybrid-based structural adhesives for the permanent bonding of dissimilar materials, including:
- Glass
- Plastics
- Metals
- Ceramics
The adhesives are characterised by high bond strength and versatile application possibilities.
Their applications range from:
- Room-temperature electronics assembly to
- Highly stressed bonds in aerospace applications
This enables the materials to meet a broad range of requirements in electronics and industrial manufacturing.