Roartis

SMD Adhesives

[Translate to Englisch:] Gerät mit Spritze druckt rote Tinte auf Leiterplatte unter rotem Licht.

    SMD Adhesives

    The product line of SMD adhesives for dispensing and printing processes was specifically developed to meet the requirements of modern electronics manufacturing.

    All IQ-BOND SMD adhesives are compatible with lead-free wave soldering processes and ensure high initial strength.
     

    As a result, they enable:

    • secure attachment of SMD components
    • high process stability
    • optimised yield in the assembly process
       

    The materials are suitable for all common SMD components and support reliable and efficient manufacturing processes.

    Product Curing Viscosity (mPa·s) Hardness Work life Notes
    IQ-Bond 2200 1–2 min @ 150°C
    5 min @ 120°C
    30 min @ 80°C    		 150,000 85 D 5 days
    • yellow
    • printing applications
    • dispensing/jetting applications
    • stamping applications
    IQ-Bond 2400 1–2 min @ 150°C
    5 min @ 120°C    		 150,000 85 D 10 days
    • yellow
    • printing applications
    • dispensing applications
    IQ-Bond 3204 1−2 min @ 150°C
    5 min @ 120°C
    30 min @ 80°C    		 250.000 85 D 10 days
    • red
    • suitable for „fine dot dispensing” with high speed
    IQ-Bond 3202 1 min @ 150°C
    5 min @ 105°C    		 600,000 85 D 5 days
    • red
    • printing applications
    IQ-Bond 3709 10 sec @ 170°C
    2 min @ 150 °C
    5 min @ 120°C    		 350,000 @ 10 rpm – 60°C > 85 D 10 days
    • red
    • Bisphenol A-free
    • suitable for “ultra-fine dot dispensing” at high speeds
    • fast-curing

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