Roartis

Sinter Materials

[Translate to Englisch:] Elektronische Leistungsmodule und Transistoren auf weißem Hintergrund.

    Sinter-Materialien

    IQ-SINTER materials comprise heat-curable, epoxy-based hybrid sintering adhesives as well as silver-based sintering pastes for demanding die-attach applications.

    They combine:

    • High temperature resistance
    • Excellent thermal conductivity
    • High electrical conductivity

    Typical applications include:

    • Power semiconductors
    • High-power LEDs
    • EV power modules in the automotive industry
    • RF applications
    • Laser diodes
    • Concentrator photovoltaic cells
    • Solder replacement technologies

     

    Despite their high filler loading, the materials have a comparatively low viscosity. This makes them ideally suited for the precise dispensing and stamping of small volumes in electronics manufacturing.

    Product Curing Viscosity (mPa*s) Colour Working Life Notes
    IQ-Sinter 5460 pressure assisted:
    air dry 10 min @ 200°C +
    sinter 5 min @ 250°C
    pressureless:
    1 hr @ 200°C    		 53.000 silver 24 h
    • sinter paste
    • high electrical conductivity (4 x 106 Ohm*cm)
    • high thermal conductivity (> 200 W/m*K)
    • suitable for pressureless and pressure-assisted sinter processes
    IQ-BOND 5451-HSCE multiple stage cure:
    15 min @ 120°C +
    ramp 15 min to 200°C    		 45.000 silver 12 Std.
    • hybrid sinter paste
    • suitable for „fine dot dispensing” with high speed
    • higher viscosity
    • improved electrical conductivity (> 60 W/m*K, 3,8 x 106 Ohm.cm)

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