Roartis

Glob Top and Dam & Fill Encapsulants

Close-up of green printed circuit boards with black components.

    Glob Top and Dam & Fill Encapsulants

    Glob-top and dam-and-fill resins provide reliable protection for sensitive electronic components such as bare silicon chips, crystal oscillators, RF components, BGAs, and CSPs.

    The epoxy-based materials are characterised by a high glass transition temperature (Tg) and a low coefficient of thermal expansion (CTE), making them suitable for demanding applications.

    They offer high resistance to:

    • Thermal cycling between −55 °C and +200 °C
    • Moisture exposure, for example 2,000 hours at 85 °C and 85% relative humidity

     

    This makes the materials ideal for applications requiring long-term reliability and protection under extreme environmental conditions.

    Product Curing Viscosity (mPa*s) CTE (ppm) Tg (°C) Working Life Hardness Notes
    IQ-Bond 2580 2 h @ 150°C
    60 min @ 165°C    		 85000 19 250 24 h 85D
    • dam applications
    • dry-ice shipment required
    IQ-Bond 2481 3 h @ 150°C
    2 h @ 90°C + 3 h @ 150°C    		 30000 18 230 12 h 85D
    • fill applications
    • dry-ice shipment required
    • low CTE
    • high Tg
    • approved for space applications

    While dam-and-fill encapsulants are generally used for larger chip applications, glob-top encapsulants are primarily used for smaller chips. To minimise process time, the chemistry of the dam-and-fill encapsulants has been optimised for a co-curing process.

    Product Curing Viscosity (mPa*s) CTE (ppm) Tg (°C) Working Life Hardness Notes
    IQ-Bond 2520 2 h @ 150°C
    60 min @ 165°C    		 100000 19 250 24 h 85D
    • high Tg
    • dry-ice shipment required
    IQ-Bond 2280 1 min @ 150°C
    4 − 5 min @ 120°C
    60 min @ 80°C    		 13000 100 35 5 days 80D
    • long working life
    • shipped in a standard insulated cool box

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