Die-Attach Adhesives
The product portfolio includes electrically conductive and insulating die-attach adhesives that have been specifically developed for demanding applications in electronics manufacturing.
The materials feature optimised rheology and enable precise and reliable processing.
They are designed for:
- High-speed dispensing
- Jetting applications
This makes the die-attach adhesives ideal for efficient manufacturing processes and reliable bonding of electronic components.
| Product | Curing | Viscosity (mPa·s) | Resistivity (ohm*cm) | Work life | Notes |
|---|---|---|---|---|---|
| IQ-Bond 5402-CE | 5 min @ 150°C 15 min @ 120°C |
78,000 | 5x10−4 | 24 h |
|
| IQ-Bond 5134-CE | 15 min @ 175°C 90 min @ 120°C |
22,000 | 2x10−4 | 12 h |
|
| IQ-Bond 5424-CE | 1 h @ 150°C 2 h @ 120°C |
16,000 | 1x10−4 | 14 days |
|
| Product | Curing | Viscosity (mPa·s) | Colour | Work life | Notes |
|---|---|---|---|---|---|
| IQ-Bond 2705 | 1 min @ 150°C 5 sec @ 170°C |
40,000 | beige | 2 days |
|
| IQ-Bond 2722 | 60 min @ 80°C | 70,000 | bright yellow | 5 days |
|
| IQ-Bond 2432-T | 15 min @ 175°C 90 min @ 120°C |
50,000 | milky/ cream-white |
12 h |
|