Solder Alloy SN100CV®
SN100CV® is a silver-free, micro-alloyed solder developed and patented by the Japanese company Nihon Superior (German (DE) patent number 60211068917.7).
Bismuth in the alloy contributes to sustained mechanical strength and long-term reliability. The micro-alloyed addition of nickel reduces copper enrichment in the solder bath and guarantees a more stable process. The nickel content also leads to a more refined intermetallic layer, which increases the long-term stability of the solder joints. A second micro-alloyed element, germanium, minimises dross formation and thus contributes to resource efficiency and environmental protection.
The alloy exhibits very good wetting behaviour and a significantly lower tendency toward bridge formation. This helps to reduce defect rates and improves overall quality.
Features
solid solution strengthening
micro-alloyed
reduced dissolution rate in comparison with S-Sn99.3Cu0.7 alloy
reduced dross formation in comparison with S-Sn99.3Cu0.7 alloy
reduced tendency for bridging and icicle formation
shiny solder joints
silver-free – cost-optimised solution
The alloy SN100CVe® with reduced copper content is available as refill solder