Solder Paste SP6000 TBS04
The solder paste SP6000 TBS04 is part of Stannol’s greenconnect product line. The use of recycled solder can reduce the raw material-related CO2 emissions of this solder paste compared with equivalent solder pastes made from primary tin. The solder paste was developed for use with lead-free alloys. The TBS04 alloy (Bi57.6Sn42Ag0.4) is a low-melting solder alloy with a melting range of 138–140 °C.
Features
- solder powder from recycled solder
- low melting point
- suitable for fine-pitch down to 0.4 mm
- excellent print definition after longer printer downtime
- reflow soldering possible in air or nitrogen
- excellent wetting on most surfaces
- RoHS compliant
Application
Paste printing: The solder paste was developed for stencil printing. SP6000 TBS04 with particle size type 4 (20–38 µm) is suitable for all common open and closed printing systems.
Cleaner
Pre soldering: cleaner Flux-Ex Pre
After soldering: cleaner Flux-Ex Post