Process stability and sustainability for high-volume SMT production
Stannol introduces SP6500, a new high-performance solder paste in the greenconnect series. SP6500 was specially developed for demanding series and mass production in surface-mounted electronics manufacturing (SMT) and combines exceptional process stability with proven environmental compatibility.
New standards in series production
SP6500 sets standards in production-relevant key figures: it guarantees constant print-to-print consistency, long stencil service life and reproducible reflow results – even over long production runs. This makes it particularly suitable for high-volume production environments where process reliability and minimised downtimes are crucial.
Performance features at a glance
- Consistent performance in stencil printing: outstanding print stability over long print cycles and reproducible results for at least six hours without re-dosing.
- Robust for high-volume production: Developed for series and mass production, with stable process windows even with demanding reflow profiles and in air or nitrogen atmospheres.
- Reliable wetting and component performance: High placement reliability, good self-alignment, low tombstoning and solder-balling rates.
- No-clean technology: Minimal, transparent residues after the reflow process – most applications do not require downstream cleaning.
Sustainability included
SP6500 not only sets standards in terms of process technology, but also ecologically:
- Solder powder made from recycled solder
- Saves around 85% CO₂ emissions compared to conventional solder pastes
- halogen-free formulation (halogen-zero)
Optimised for modern production requirements
SP6500 supports applications in the fine pitch range up to 0.4 mm and offers excellent tackiness for high-speed pick-and-place machines. It is also compatible with almost all common stencil printing systems, ensuring high flexibility in a wide range of production environments.