Stannol will be exhibiting at the new trade fair in Stuttgart from October 6 to 8, 2026. At booth 9C64, the company will showcase, among other things, the SP6000 and SP6500 solder pastes and explain how process reliability, reproducibility, and sustainability can be combined in SMT manufacturing.
Spotlight on SP6000 and SP6500 Solder Pastes
The SP6000 solder paste was developed for use with all lead-free alloys and offers optimized wetting properties on all known lead-free PCB and component coatings. The product is designed for low-volume/high-mix applications and combines versatility with cost-efficiency.
SP6500 solder paste was developed for manufacturers who require maximum process stability and consistently high quality in high-volume/low-mix SMT production. The specially developed formulation ensures consistently high run-to-run consistency, long stencil life, and reliable reflow results.
Cost-Effective and Sustainable
SP6000 and SP6500 are part of Stannol’s sustainable greenconnect series. Thanks to the use of recycled solder, they have a reduced CO₂ footprint compared to conventional solder pastes. Both solder pastes are well-suited for use with low-silver content alloys (TSC105, TSC0307) and silver-free alloys (SN100CV).
Sustainability and Process Stability in Dialogue
“EFX gives us the opportunity to showcase our solutions for various requirements in electronics manufacturing directly through technical discussions. With SP6000 and SP6500, we are presenting two solder pastes that combine sustainability and reliable processes in different ways,” explains Thomas Kolossa, Sales Manager at Stannol.
At the Stannol booth, Thomas Kolossa, along with application engineer Eileen Arndt and application engineers Dirk Rüdell and Werner Mittermann, will be available for discussions.