Rising material costs and volatile silver prices are increasing pressure on SMT manufacturing. With its low-silver solder pastes SP6000 and SP6500, Stannol offers two high-performance no-clean solutions that reduce the silver content, thereby supporting cost-effective, sustainable, and reliable manufacturing.
Both solder pastes are available with the low-silver alloys SnAg1.0Cu0.5 and SnAg0.3Cu0.7. This selection allows for targeted
tailoring to different manufacturing requirements – from flexible standard processes to demanding fine-pitch applications.