We are pleased to present the Stannol Smart 4D Thermal Profiler live at our booth at productronica, taking place from November 18 to 21, 2025, in Hall 4, Booth 470. The device enables precise analysis of temperature profiles in reflow soldering processes and supports companies in optimizing their production quality. The Stannol Smart 4D Thermal Profiler will be presented by its developer, Vitor Barros.
Experience the precision of 4D profiling for stable soldering processes firsthand!
Presentation dates
- Tuesday, 18.11.2025, 2.00 p.m.
- Wednesday, 19.11.2025, 11.00 a.m. and 3.00 p.m.
- Thursday, 20.11.2025, 11.00 a.m. and 3.00 p.m.
Each presentation lasts approximately 20 to 30 minutes. Afterward, our application engineers on site will be happy to answer any questions about the device and its possible applications.
Four-dimensional data acquisition
In modern soldering processes, precise temperature control is crucial in order to reliably achieve good solder joints and avoid failures. The Stannol Smart 4D Thermal Profiler measures and analyzes the temperature curves directly on the assembly so that problems can be detected early and processes can be optimally adjusted.
The device uses real 4D profiling for this purpose: it records the temperature (at the sensors), the system temperature (using pyrometers), the vibration measurement in XYZ (using acceleration sensors) and the time curve.