Flux EF210
The halogen-free activated No-Clean flux EF210 has a low activity due to its solid content. The advantage here is the small amount of residue that EF210 leaves behind. These residues can remain on the solder joints. The low resin content increases the electrical safety of the residues without noticeably increasing their quantity.
Features
- low, electrically safe residues
- good foaming properties
- No- Clean
Application
The flux EF210 is suitable for spray and foam fluxers. Due to the low activity, good results are achieved when used in full-tunnel nitrogen soldering systems.
Alloy
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