The Stannol solder paste SP2300 is type 5 (15 to 25 µm) and particularly suitable for use around smaller components. It shows a strongly reduced void formation and delivers excellent printing results. The solder paste can be used in all common open printing systems. With a special formula for excellent wetting, it also meets the requirements of high-volume production. The wetting properties have been optimised for all known lead-free PCB and component coatings. The small amounts of residue left after reflow soldering are electrically safe and do not need to be removed. The solder paste is also available in as type 4 (20 to 38 µm).

More info on Stannol solder paste SP2300 is available in the technical data sheet.