The Flowtin series developed by Stannol has been synonymous for years with reliable soldering processes, minimal material removal, and high process stability. Now, scientific research has provided independent confirmation: A doctoral research project at Óbuda University in Hungary investigated the properties of Stannol’s microalloyed solder and demonstrated several positive effects.
The study, titled “Thermal, Microstructural, and Morphological Analysis of Co-Ni-Ce Microalloyed SAC305 Lead-Free Solder Solidified at Low Cooling Rate” by Béla Bődi and Viktor Gonda examines the effect of the Co-Ni-Ce microalloy on SAC305 solder. The focus was on thermal, microstructural, and morphological properties during slow cooling.
The result: The microalloy offers clear advantages for demanding manufacturing processes. Among other things, the study observed
- stabilization of intermetallic phases
- a finer microstructure
- a reduction in shrinkage cracks, and
- improved mechanical properties.
Overall, the study points to a significantly increased reliability of solder joints.
For Stannol, this is important evidence: Flowtin is not only a patented in-house development from the research and development department, but also technologically strong precisely where it matters most in practice – in processes with high demands on durability, quality, and reproducibility.