The micro-alloyed solder of the FLOWTIN series are introduce on the market some time ago and have proven particularly stable solder baths with extremely low copper dissolution. A further development of this micro-alloyed solder is FLOWTIN +. This development targeted "cost reduction at the customer site" and not only by the replacement of silver in the alloy. The "plus" in FLOWTIN + stand for another micro-alloy component, which can reduce the formation of dross by up to 50%! Troublesome and time-consuming skimming and collecting dross is reduced to a minimum and our customers can concentrate on more important tasks. Flowtin + is available in the silver-free tin-copper alloy Sn99Cu1 (Flowtin + TC).