On 18 and 19 September, Stannol will be an exhibitor at the FED Conference in Ulm.

The FED Conference has been bringing together practitioners and decision-makers from industry and applied research for 30 years. The two-day event with accompanying exhibition and more than 350 participants is an important forum for discussing new and tried-and-tested methods and tools for the development and production of printed circuit boards, alternative circuit carriers and electronic assemblies, as well as management processes and industry trends.

Our experts Ingo Lomp and Nicolas Wiacker are looking forward to interesting discussions!