Tin Solder Flowtin TSC

Flowtin TSC (Sn95.5Ag3.8Cu0.7) is a lead-free, eutectic solder analogous to ISO 9453 (alloy number 713) with micro-alloyed additives (<0.1%).

The FLOWTIN TSC alloy is manufactured from pure metals and has been developed to minimise the disadvantages of conventional lead-free tin/silver/copper alloys regarding dissolution of metals and impurities resulting from these and to guarantee a stable, lead-free soldering process.

Tin Solder Flowtin TSC
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Features

  • with 217 °C, it has the lowest melting point of alloys with high tin content
  • eutectic alloy (defined melting point)
  • improved wetting characteristics, more fine-grained and smoother surface than conventional SnAgCu alloys
  • reduced dissolution rate in comparison with conventional SnAgCu alloys and as a result significantly increased service lives of the solder baths

Application

The use of Flowtin TSC as wave solder requires a solder bath temperature of approx. 260 to 280 °C. The use of inert gas means a significant extension of the process window. The wetting of the solder is made easier and on exit from the wave, no excess solder remains attached to the components. The dross formation is also considerably minimised. Flowtin TSC can also be used in selective soldering systems.

Alloy

  • Sn95,5Ag3,8Cu0,7
  • Sn95,5Ag3,8Cu0,7
  • Sn95,5Ag3,8Cu0,7
  • Sn95,5Ag3,8Cu0,7 FLOWTIN
  • Sn95,5Ag3,8Cu0,7 FLOWTIN
  • Sn95,5Ag3,8Cu0,7 FLOWTIN

Downloads

Technical datasheet Technical datasheet Safety data sheet

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