Tin Solder Flowtin TSC305
Flowtin TSC305 (Sn96.5Ag3Cu0.5) is a lead-free, eutectic solder analogous to ISO 9453 (alloy number 711) with micro-alloyed additives (<0.1%).
The Flowtin TSC305 alloy is manufactured from pure metals and has been developed to minimise the disadvantages of conventional lead-free tin/silver/copper alloys regarding dissolution of metals and impurities resulting from these and to guarantee a stable, lead-free soldering process.
Product Advantages
- good wetting characteristics
- melting range of 217 to 222 °C
- more fine-grained and smoother surface than conventional SnAgCu alloys
- reduced dissolution rate in comparison with conventional SnAgCu alloys and as a result significantly increased service lives of the solder baths
- more economical than eutectic SnAgCu alloy due to 0.8% lower silver content
Application
The use of Flowtin TSC305 as wave solder requires a solder bath temperature of approx. 260 to 280 °C. The use of inert gas means a significant extension of the process window. The wetting of the solder is improved and no excess solder remains on the components when exiting the wave. Furthermore, dross formation is considerably minimised. Flowtin TSC305 can also be used in selective soldering systems.
Available Delivery Forms
- Formblock 7
- Kilo bar
- Triangular bar, casted
Contact person
Do you have any questions about our products?
Our application engineers will be happy to help you. Contact us, we are here for you!
Distribution Network
Further countries with our distributors' contacts can be found here:
Distribution Network