Tin solder Flowtin TSC263
Flowtin TSC263 (Sn97,1,5Ag2,6Cu0,3) is a lead-free solder in accordance with ISO 9453 with microalloying additives (<0,1%).
The alloy is made from pure metals and was developed to minimise the disadvantages of conventional lead-free tin/silver/copper alloys in terms of metal alloying and the resulting impurities and to ensure a stable lead-free soldering process.
Product Advantages
- good wetting behaviour
- melting range from 217 to 224 °C
- properties comparable to Flowtin TSC305
- improved wetting properties, finer-grained and smoother surface than conventional SnAgCu alloys
- reduced dissolution rate in comparison with conventional SnAgCu alloys and as a result significantly increased service lives of the solder baths
- more economical than eutectic SnAgCu alloys due to 1.2 % lower silver content
Application
The use of Flowtin TSC263 as wave solder requires a solder bath temperature of at least 265 °C. The use of inert gas means a significant extension of the process window. The wetting of the solder is improved and no excess solder remains on the components when exiting the wave. Furthermore, dross formation is considerably minimised. Flowtin TSC263 can also be used in selective soldering systems.
Available Delivery Forms
- Formblock 7
- Kilo bar
- Triangular bar, casted
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